Passive CPU Cooler 1U Solution
Copper Heatsink (Heat-Sink) for 1U Server
Dynatron (Top Motor) Hawaii Series H15 180°
for Intel® Xeon™ Nocona 800MHz Socket 604 up to 3.6GHz

Model Number: Dynatron Hawaii Series H15
Application: Intel® Xeon™ Nocona 800MHz Socket 604 up to 3.6GHz
Overall Dimension: 90 x 78 x 25 mm
Thermal Compound: ----
Weight: 605 g

Heat Sink Dimension: 90 x 78 x 26.5 mm
Heat Sink Material: Copper C1020
Heat Sink Pitch: 1.00 mm
Thickness of Fin: 0.50 mm
Number of Fin: 42
Height of Fin: 20.00 mm
Height of Base: 7.00 mm
Length of Base: 90.0 mm