Passive CPU Cooler 1U Solution
Copper Heatsink (Heat-Sink) for 1U Server
Dynatron (Top Motor) Hawaii Series H11 180°
for Intel® Xeon™ Socket 423, 603, 604

Model Number: Dynatron Hawaii Series H11
Application: Intel® Xeon™ Socket 423, 603, 604 up to 2.8GHz
Overall Dimension: 89.5x63.5x25 mm
Thermal Compound: ----
Weight: 420 g

Heat Sink Dimension: 89.5x63.5x25 mm
Heat Sink Material: Copper C1020
Heat Sink Pitch: 1.70 mm
Thickness of Fin: 0.55 mm
Number of Fin: 39
Height of Fin: 20.85 mm
Height of Base: 3.73 mm
Length of Base: 88.79 mm