Passive CPU Cooler Copper Heatsink (Heat-Sink) Dynatron (Top Motor) Irvine Series i51 Passive CPU Cooler Intel® recommended Pentium® M & Celeron® M in micro-FCPGA package Xeon® Sossaman CPU processor HSC-M-I51-FCPGA |
|
Passive CPU Cooler Copper Heatsink (Heat-Sink) Dynatron (Top Motor) Irvine Series i51 Passive CPU Cooler Intel® recommended Pentium® M & Celeron® M in micro-FCPGA package Xeon® Sossaman CPU processor Model Number: Dynatron Irvine Series I51 Application: Intel® recommended Pentium® M Processor & Celeron® M processors in micro-FCPGA package, Xeon® Sossaman CPU processor Overall Dimension: 50 x 50 x 25 mm Thermal Compound: ---- Weight: 162 g Heat Sink Dimension: 50 x 50 x 25 mm Heat Sink Material: Copper C1020 Heat Sink Pitch: 1.080 mm Thickness of Fin: 0.50 mm Number of Fin: 19 Height of Fin: 22.00 mm Height of Base: 3.00 mm Length of Base: 50.0 mm |