|
CPU Cooling
Fan with Heatsink (Heat-Sink) Dynatron (Top Motor) Hawaii Series H6EG Active CPU Cooler for Intel® Xeon® WoodCrest & Dempsey Socket 771 3.73GHz & up for 2U server FNC-Xeon-H6EG-771 |
 |
|
CPU Cooling
Fan with Heatsink (Heat-Sink)
Dynatron (Top Motor) Hawaii Series H6EG Active CPU Cooler for Intel® Xeon® WoodCrest & Dempsey Socket 771 3.73GHz & up for 2U server Model Number: Dynatron ( Top Motor ) Hawaii Series H6EG Application: Intel® Xeon® Dempsey Socket 771 3.73GHz & up for 2U server Overall Dimension: 94.0 x 76.5 x 67.0 mm Thermal Resistance: ---- Weight: 820 g RoHS Compliance Fan Dimension: 60x60x25 mm Fan Speed: At Duty Cycle 25%: 5500 rpm At Duty Cycle 50%: 6500 rpm At Duty Cycle 100%: 8500 rpm Bearing: Double Ball Bearing Rated Voltage: 12V Rated Current: ---- Power: At Duty Cycle 25%: 2.5 W At Duty Cycle 50%: 3.6 W At Duty Cycle 100%: 7.92 W Operation Temp.: -10°C ~ +65°C Air Flow: At Duty Cycle 25%: 28.91 cfm At Duty Cycle 50%: 34.16 cfm At Duty Cycle 100%: 44.68 cfm At Duty Cycle 25%: 31.1 dBA At Duty Cycle 50%: 39.5 dBA At Duty Cycle 100%: 48.8 dBA Air Pressure: At Duty Cycle 25%: 0.329 inch-H2O At Duty Cycle 50%: 0.460 inch-H2O At Duty Cycle 100%: 0.786 inch-H2O Lead Wire Pin Out: Pin1-Black (-) Pin2-Yellow (+) Pin3-Green (Techometer/Signal output) Pin4-Blue (PWM) Heat Sink Dimension: 94 x 76.5 x 26 mm Heat Sink Material: Copper C1020 Heat Sink Pitch: ---- mm Thickness of Fin: ---- mm Number of Fin: ---- Height of Fin: ---- mm Height of Base: ---- mm Length of Base: ---- mm |