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CPU Cooling
Fan with Heatsink (Heat-Sink) Dynatron (Top Motor) Hawaii Series H6D Active CPU Cooler for Intel® Dual-Core Xeon® 5000 sequence Dempsey MV Socket 771 for 2U server and up FNC-Xeon-H6DG-771 |
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CPU Cooling
Fan with Heatsink (Heat-Sink)
Dynatron (Top Motor) Hawaii Series H6DG Active CPU Cooler for Intel® Dual-Core Xeon® 5000 sequence Dempsey MV Socket 771 for 2U server and up Model Number: Dynatron ( Top Motor ) Hawaii Series H6DG Application: Intel® Dual-Core Xeon® 5000 sequence, Dempsey MV Socket 771 for 2U server and up 8Ghz ) 2U server & Up Overall Dimension: 94.0 x 76.5 x 67.0 mm Thermal Resistance: ---- Weight: 820 g RoHS Compliance Fan Dimension: 60x60x25 mm Fan Speed: At Duty Cycle 25%: 4000 rpm At Duty Cycle 50%: 5000 rpm At Duty Cycle 100%: 7400 rpm Bearing: Double Ball Bearing Rated Voltage: 12V Rated Current: ---- Power: At Duty Cycle 25%: 1.32 W At Duty Cycle 50%: 2.12 W At Duty Cycle 100%: 6.36 W Operation Temp.: -10°C ~ +65°C Air Flow: At Duty Cycle 25%: 18.74 cfm At Duty Cycle 50%: 23.45 cfm At Duty Cycle 100%: 37.58 cfm At Duty Cycle 25%: 31.1 dBA At Duty Cycle 50%: 35.9 dBA At Duty Cycle 100%: 46.8 dBA Air Pressure: At Duty Cycle 25%: 0.165 inch-H2O At Duty Cycle 50%: 0.278 inch-H2O At Duty Cycle 100%: 0.5 inch-H2O Lead Wire Pin Out: Pin1-Black (-) Pin2-Yellow (+) Pin3-Green (Techometer/Signal output) Pin4-Blue (PWM) Heat Sink Dimension: ---- mm Heat Sink Material: Copper C1020 Heat Sink Pitch: ---- mm Thickness of Fin: ---- mm Number of Fin: ---- Height of Fin: ---- mm Height of Base: ---- mm Length of Base: ---- mm |